Solving complex 3D packaging challenges
自1998年以来，Amk狗万注册地址or Technology一直是开发和提供高容量、低成本3D封装技术的先驱。我们通过部署进行开发的方法超越了需要3D技术的应用程序和打包平台的范围。客户受益于这种方法，因为新的三维包装解决方案更有效地鉴定和坡道高容量，低成本，跨多个工厂。汽车、工业、高端消费者、多媒体、可穿戴设备、物联网和人工智能领域的新产品设计要求以创新的形式因素和样式提供这些功能。通过以最低的成本提供最高水平的硅集成和面积效率，3D封装正在经历高速增长和新的应用。
Critical 3D platform technologies include:
- Design rulesand infrastructure for thinner, high-density substrate technologies
- 先进的晶圆细化和处理系统
- Thinner die attach and die stacking processes
- High density and low loop wire bonding
- Pb-free and environmentally conscious green material sets
- Flip chipplus wire bond mixed technology stacking
- Turnkey die and package stacking assembly and test flows
Die Stacking
Amkor’s die stacking technologies are widely deployed in high volume manufacturing across multiple factories and product lines. Next-generation die stacking technology includes the ability to handle wafers and die thinned down to below 30 µm. Customers rely on Amkor’s turnkey and leading-edge capabilities in design, assembly and test to solve their most complex 3D packaging and time to market challenges. Next-generation die stacking technology includes the ability to handle wafers and die thinned below 30 μm. It can then be reliably stacked and interconnected with up to 16 active dies, employing leading-edge die-attach, wirebond and flip chip assembly capabilities.
Die stacking technologies have been demonstrated up to 24 die stacks, however, most stack-ups greater than 9 die high use a combination of die and package stacking technologies to address complex test, yield and logistic challenges. Die stacking is also widely deployed in conventional leadframe-based packages including QFP, MLF® and SOP formats. Leveraging Amkor’s industry-leading infrastructure for high volume, low-cost leadframe production, system designers can achieve significant savings in PCB real estate and overall cost.
Package Stacking: Package-on-Package (PoP)
Stacking of fully assembled and tested packages is an area where Amkor has provided significant innovation to overcome the technical, business and logistics challenges associated with complex die stacks. Amkor launched the popular Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) platform in 2004. PSvfBGA supports single die, stacked die using wirebond or hybrid (flip chip plus wirebond) stacks and has been applied to flip chip applications to improve warpage control and package integrity through test and SMT handling.
The next few years promise to provide many new challenges and applications for PoP, as communications, artificial intelligence and networking applications continue to demand higher signal processing power and data storage capabilities. Amkor is committed to maintaining strong development and production capabilities to ensure we are at the forefront in meeting next-generation PoP requirements.
Questions?
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