Our packaging and technology solutions address demanding challenges faced by automotive IC manufacturers
Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. Amkor offers an industry-leading portfolio of automotive packaging technologies including:
- Low-Cost Flip Chip
- Wafer Level Chip Scale Packaging (WLCSP)
- System in Package (laminate and wafer-based)
- MEMS and Sensor
- Leadframe
- 权力Discrete
Enabling the future of automotive
The automotive industry is going through a revolution, and with this growth comes opportunities for stakeholders to add economic value to end users. Several environmental, economic and social factors are influencing future electric vehicle designs, safety and powertrain choices. Whether it’s ADAS, infotainment or electrification applications, performance and reliability aspects shape each player’s strategy.
Semiconductor suppliers, including OSATs, offer packaging technologies that are cutting edge, reliable and cost effective to realize various functional ability for evolving automotive applications. Amkor is the leading automotive OSAT for providing turnkey solutions, including wafer sort, bump services, packaging, test and burn-in, to meet aggressive go-to-market plans. Amkor’s factories are IATF16949 certified and adhere to highest levels of quality controls.
Chassis Electronics
Package Types:
Used In:
- Anti-lock braking system
- Suspension
- Steering control
- Tire pressure monitoring
Enabling Technologies:
- Inertial, pressure and other sensors
- A/D and D/A converters
- Transceivers
- Level and roll control
xEV
Package Types:
Used In:
- Traction inverter
- On-board charger
- Battery management systems
Enabling Technologies:
- 权力conversion
- DC-DC step up/step down
Safety
Package Types:
Used In:
- Airbags
- TPMS
- Event data recorder
Enabling Technologies:
- MCUs
- Sensors
- Amplifiers
- Inertial Measurement Units
Body Electronics
Package Types:
Used In:
- Climate control
- Doors/seats
- Entry/exit
- Lighting
Enabling Technologies:
- LEDs and LED drivers
- PMICs
- NFC和连接器(可以/林,以太网总线)
Infotainment & Telematics
Package Types:
Used In:
- Display (in-panel and head-up)
- Navigation systems
- Vehicle to everything (V2X)
- Audio
- Security
Enabling Technologies:
- SoCs
- PMICs, RFICs
- Sensors
- LED drivers
- Touch screen controllers
- CAN transceivers
- MCUs
ADAS
Package Types:
Used In:
- Automatic emergency braking
- Adaptive cruise control
- Collision warning
- Lane keep assist
- Parking assist
Enabling Technologies:
- SoCs
- CMOS image sensors
- mmWave radar
- LIDAR
- PMICs
- MCUs
权力train
Package Types:
Used In:
- Engine computer
- Fuel injection
- Start-stop systems
- Electric motor control
- Battery management
Enabling Technologies:
- MCUs
- Sensors
- Transceivers & Connectors (CAN/LIN, Ethernet buses)
